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  1. Advanced Packaging, Wafer Level Packaging, Semiconductor Packaging & Circuit Materials : DuPont Electronics

    DuPont offers a growing portfolio of semiconductor packaging materials. New materials solutions span wafer level packaging, including wafer bumping, TSV, 3D, ...
    mems1
    tsv1
    flip chip1
    flexible circuit1
    3d packaging1
    wafer level packaging1

    packaging-circuits.dupont.com - 2009-04-11

  2. NxGEN Electronics; It's in the name.

    NxGen Electronics, Advanced Packaging Technologies
    CSP1
    BGA1
    Tessera1
    ball grid array1
    Nexgen1
    advanced packaging1
    chip scale1
    DDR II1
    FBGA1
    fold-over1
    chip scale package1
    UBGA1
    3D packaging1
    land grid array1
    3D package1
    integrated passives1
    die stacking1
    ball stack1
    die stack1
    fine pitch BGA1
    chip scale technology1
    compliant chip1
    compliant layer1
    NxGen1
    Nexgen Elect1
    Nexgen Electronics1
    Nxgen Elect1
    NxGen Electronics1
    Nxgen San Diego1

    www.dodgedemonclub.com - 2009-04-03

  3. TESSERA TECHNOLOGIES

    UBGA, 3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. Tessera ...
    MCP2
    package design2
    CSP1
    BGA1
    memory modules1
    ball grid array1
    advanced packaging1
    micro BGA1
    chip scale1
    DDR II1
    FBGA1
    fold-over1
    chip scale package1
    UBGA1
    3D packaging1
    land grid array1
    3D package1
    integrated passives1
    die stacking1
    ball stack1
    die stack1
    fine pitch BGA1
    package solutions1
    chip scale technology1
    compliant chip1
    compliant layer1
    multi-chip1
    MBGA1
    microZ miniaturization1
    multi-chip package1
    package stacking1

    global.tessera.com - 2009-04-09

  4. signal integrity, high speed, IR drop, substrate design, flip chip, cavity down, power integrity, CO design, reliability modeling, 3D package, 3D packaging, ...

    3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. broadpak produces ...
    high speed2
    MCP2
    package design2
    CSP1
    BGA1
    memory modules1
    ball grid array1
    flip chip1
    signal integrity1
    advanced packaging1
    chip scale1
    DDR II1
    FBGA1
    chip scale package1
    3D packaging1
    land grid array1
    3D package1
    die stacking1
    ball stack1
    die stack1
    fine pitch BGA1
    MBGA1
    power integrity1
    CO design1
    IR drop1
    multi chip1
    reliability modeling1
    cavity down0
    memory stacking0
    multi chip package0
    substrate design0

    www.broadpak.com - 2009-02-11

  5. Studio Davis / Structural Packaging, Brand Development, NPD

    Design agency specializing in Structural Packaging, Brand Development and New Product Development
    product design2
    brand development2
    packaging design2
    3d design2
    brand design1
    new product development1
    NPD1
    product innovation1
    structural packaging1
    3d packaging1
    packaging innovation1
    3d branding1
    will davis1
    3d brand1
    tufa pure1
    whitehole springs1
    studio davis0
    wil davis0

    www.studio-davis.com - 2009-02-08

  6. Surface Design - Repeat Surface Pattern Design, 3D Tabletop Product Design, Fabric Design, Gift Wrap, Paper Plate and Dinnerware Design www.surfacedesign.com

    SurfaceDesign - Repeat Surface Pattern Design for fabric, tableware, partyware, gift bags, 3D tabletop decor. Unique hand-drawn, hand-painted and digitally ...
    cam5
    graphic designer3
    famous2
    award winning2
    dinnerware2
    tabletop2
    watercolor painting1
    textile design1
    Surface Design1
    textile artist1
    watercolour painting1
    fabric design1
    paper plates1
    textile designer1
    fabric artist1
    fabric designer1
    3d packaging1
    gift wrap paper1
    giftware design1
    surface pattern design1
    giftwrap design1
    3D digital artist1
    AVA Cad1
    AVA cadcam1
    3D Maya computer graphics0
    freelance Surface Designer0
    paper plate patterns0
    repeat pattern design0
    repeat pattern designer0
    surface designs0
    surface pattern artist0

    www.surfacedesign.com - 2009-02-13

fine pitch bga1 bga1 land grid array1 ball grid array1 csp1 chip scale package1 fbga1 die stacking1

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